Tungsten metal

CAS Number: 7440-33-7

Molecular Formula: W

About Tungsten metal

Source high-purity Tungsten Metal (CAS 7440-33-7) from Scimplify, one of the trusted global tungsten metal suppliers and manufacturers. Tungsten (W), also known as wolfram, is a refractory metal with the highest melting point of any metal at around 3,410 degrees Celsius.We supply tungsten metal as high-purity powder ac...

Tungsten metal Specifications

CAS Number

7440-33-7

Molecular Formula

Molecular Weight

183.84

IUPAC Name

tungsten

Canonical SMILES

[W]

InChI Key

WFKWXMTUELFFGS-UHFFFAOYSA-N

InChI

InChI=1S/W

CAS Number

7440-33-7

Molecular Formula

Molecular Weight

183.84

IUPAC Name

tungsten

Canonical SMILES

[W]

InChI Key

WFKWXMTUELFFGS-UHFFFAOYSA-N

InChI

InChI=1S/W

Molecular Weight

183.84

Melting Point (Experimental)

3410°C

Boiling Point (Experimental)

5900°C Press: 760 Torr

Density (Experimental)

18.7-19.3 g/cm³ Temp: 20 °C

Hard Metals

The largest downstream use. Tungsten powder is blended with carbon and carburised into tungsten carbide (WC), the basis of cemented-carbide cutting tools, drill bits, dies, and wear parts. Powder particle size controls the grain size and performance of the finished carbide.

Lighting & Electronics

Processed into wire and rod for lamp filaments, high-temperature heating elements, electron-tube and vacuum-tube electrodes, and X-ray tube anodes, drawing on tungsten's high melting point, electrical conductivity, and dimensional stability

Welding

Pure and doped tungsten (ceriated, lanthanated, zirconiated) is used for gas tungsten arc welding electrodes, valued for high-temperature stability, arc consistency, and long service life.

Aerospace & Defense

Feedstock for tungsten heavy alloys (W-Ni-Fe, W-Ni-Cu) used in balance weights and counterweights, rotor and turbine components, rocket nozzles, vibration-damping tooling, and kinetic-energy penetrators, where maximum mass in minimal volume is required.

Electronics & Semiconductors

Used for sputtering targets, interconnect metallization, and thin films in semiconductor and display manufacturing, as well as electrical contacts and tungsten-copper composites, additive manufacturing, and metal injection moulding

COA

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