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Epoxy Resins

Epoxy Resins

CAS Number: 25068-38-6

Molecular Formula: C21H25ClO5

IrritantIrritant
Reactive Epoxy Binders & DiluentsSolid Binders for Powder CoatingsGrade: Epoxy resins & Solid Epoxy resins

About Epoxy Resins

Our Epoxy Resin portfolio encompasses a comprehensive range of molecular weights and specialized polymer modifications, engineered to bridge heavy industrial requirements with ultra-pure specifications for Semiconductors, Electronic Chemicals, Advanced Substrates, and CMP Slurries. As a premier Epoxy Resin supplier, we...

Synonyms

  • DGEBA diacrylate
  • ED 20 acrylate
  • E 44, acrylate
  • EP 828 acrylate
  • YD 128 acrylate
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Epoxy Resins Specifications

CAS Number
25068-38-6
Molecular Formula
C21H25ClO5
Molecular Weight
392.9 g/mol
IUPAC Name
2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;prop-2-enoic acid
Canonical SMILES
CC(C)(C1=CC=C(C=C1)O)C2=CC=C(C=C2)O.C=CC(=O)O.C1C(O1)CCl
InChI Key
RYSXGWPNVZQNNB-UHFFFAOYSA-N
InChI
InChI=1S/C15H16O2.C3H5ClO.C3H4O2/c1-15(2,11-3-7-13(16)8-4-11)12-5-9-14(17)10-6-12;4-1-3-2-5-3;1-2-3(4)5/h3-10,16-17H,1-2H3;3H,1-2H2;2H,1H2,(H,4,5)
PubChem CID
169944
EINECS Number
920-018-0

Epoxy Resins FAQs

Minimum Order Quantity

25 kg (evaluation) · 1 MT (commercial)

Lead Time

3 – 5 weeks estimated

Delivery Terms

FOB*

Packaging

20 L pails, 200 L HDPE drums, 1000 L IBC

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