1-Ethylpiperazine

CAS Number: 5308-25-8

Molecular Formula: C6H14N2

Purity: 1-Ethylpiperazine 98% purity

About 1-Ethylpiperazine

1-Ethylpiperazine (CAS 5308-25-8) is currently witnessing robust demand within the API intermediates market as a fundamental building block for the synthesis of fluoroquinolone antibiotics, including Enrofloxacin and Ciprofloxacin, requiring high purity fine chemicals (Pharma/API purity 99%). N-Ethylpiperazine serves a...

Synonyms

1-Ethylpiperazine
5308-25-8
N-Ethylpiperazine
Piperazine, 1-ethyl-
N-ethyl piperazine

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1-Ethylpiperazine Specifications

CAS Number

5308-25-8

Molecular Formula

C6H14N2

Molecular Weight

114.19 g/mol

IUPAC Name

1-ethylpiperazine

Canonical SMILES

CCN1CCNCC1

InChI Key

WGCYRFWNGRMRJA-UHFFFAOYSA-N

InChI

InChI=1S/C6H14N2/c1-2-8-5-3-7-4-6-8/h7H,2-6H2,1H3

HSN No

29339900

CAS Number

5308-25-8

Molecular Formula

C6H14N2

Molecular Weight

114.19 g/mol

IUPAC Name

1-ethylpiperazine

Canonical SMILES

CCN1CCNCC1

InChI Key

WGCYRFWNGRMRJA-UHFFFAOYSA-N

InChI

InChI=1S/C6H14N2/c1-2-8-5-3-7-4-6-8/h7H,2-6H2,1H3

HSN No

29339900

Molecular Weight

114.19 g/mol

Purity

1-Ethylpiperazine 98% purity

Pharmaceutical Intermediate

An important building block utilized in the synthesis of various medicinal compounds, particularly central nervous system agents, antidepressants, anti-anxiety medications, and active pharmaceutical ingredients like ciprofloxacin ethyl

Agrochemical Intermediate

A versatile precursor used in the development of agrochemical products, including pesticides and herbicides, to enhance efficacy and support agricultural productivity

Dye Intermediate

A synthetic raw material employed as a precursor in the production of specialized dyes and organic pigments

Organic Synthesis Building Block

A functionalized heterocyclic reagent used in academic and industrial research for the preparation of complex organic molecules and specialty chemicals

Industrial Additive

A functional component used in the formulation of corrosion inhibitors for metal protection and as an additive in electroplating processes to enhance coating quality.