Sputtering Targets (CAS NO : 7429-90-5)

Our premium, industrial-grade Common Sputtering Target Materials are high-performance (PVD) components engineered to deposit flawless, uniform thin-film coatings for semiconductors, optics, displays, and solar cells. Available for global wholesale purchase at highly competitive contract pricing, our direct-from-factory catalogue features ultra-high purity grades from 99.9% up to 99.999% (5N) to completely eliminate film contamination risks. We supply a comprehensive inventory of certified materials with verified CAS numbers, including Aluminium (Al, CAS 7429-90-5), Copper (Cu, CAS 7440-50-8), Titanium (Ti, CAS 7440-32-6), Nickel (Ni, CAS 7440-02-0), Chromium (Cr, CAS 7440-47-3), Gold (Au, CAS 7440-57-5), Platinum (Pt, CAS 7440-06-4), Silver (Ag, CAS 7440-22-4), Tungsten (W, CAS 7440-33-7), Silicon (Si, CAS 7440-21-3), and Indium Tin Oxide (ITO, CAS 50926-11-9). Processed via advanced vacuum melting and hot-pressed sintering, these materials exhibit dense microstructures and controlled crystal orientations that guarantee constant erosion rates and precise film thickness during magnetron sputtering. Optimised for high-volume manufacturing seeking maximum process efficiency, these materials are fully customisable into round discs, planar plates, and rotatable cylinders tailored to your vacuum systems. For heavy-duty operations, each target can be seamlessly bonded to copper or molybdenum backing plates using flux-free indium solder to maximise heat dispersion. To ensure rapid installation and zero particle generation during burn-in, every target is mirror-polished (Ra < 0.3 µm) and vacuum-sealed in cleanroom-compatible packaging. As an established global sputtering target supplier, we offer dependable supply chains, tiered container-load discounts, and complete regulatory compliance documentation such as CoA, dimensional inspection sheets, and trace element mass spectrometry logs, making us the ideal choice for scaling your operations from R&D to mass production.