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Sputtering Targets

Sputtering Targets

CAS Number: 7429-90-5

About Sputtering Targets

Our premium, industrial-grade Common Sputtering Target Materials are high-performance (PVD) components engineered to deposit flawless, uniform thin-film coatings for semiconductors, optics, displays, and solar cells. Available for global wholesale purchase at highly competitive contract pricing, our direct-from-factory...

Sputtering Targets Specifications

CAS Number
7429-90-5
IUPAC Name
aluminum; manganese
HSN No
85439000
Precautionary Statement Codes
P210, P223, P231+P232, P240, P241, and P280
Hazard Classes and Categories
Flam. Sol. 1 (100%) Water-react. 2 (100%)

Semiconductor Material

A high-purity source material used in physical vapor deposition (PVD) to deposit conductive interconnects, barrier layers, and gate electrodes on silicon wafers

Optical Coating Source

A precision material utilized to create anti-reflective, reflective, and filtering thin films for lenses, mirrors, and display technologies

Photovoltaic Material

A critical component in the production of thin-film solar cells for depositing transparent conductive oxides and absorber layers

Data Storage Material

A specialized material used to deposit magnetic layers and protective overcoats on hard disk drives and magnetic media

Wear-Resistant Coating

A functional material employed to apply hard, corrosion-resistant, or biocompatible thin films onto industrial tools and medical implants.

Sputtering Targets FAQs

Minimum Order Quantity

25 kg (pilot) · 1 MT (commercial)

Lead Time

3 – 5 weeks ex-works

Incoterms

FOB · CIF

Packaging

20 L pails, 200 L HDPE drums, 1000 L IBC

Regional Availability

India · EU · Middle East · Southeast Asia

Documentation

SDS · COA · TDS available on request

Compliance & Quality

REACH registered*

GHS/SDS available

ISO 9001:2015 site*

RoHS compliant*

Global sourcing network

Consistent quality & reliability

End-to-end technical support

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